Reactive Ion Etching System III - Trion
|The Minilock II Reactive Ion Etching system is a RF plasma etch tool. This tool is used to etch silicon nitride, silicon dioxide, Si, aluminum and GaAs. Gases available include Oxygen, Chlorine, Boron Trichloride (BCl3), Tetrafluoromethane (CF4) and Hydrogen. System has a loadlock pumped by a rotary vane mechanical pump. The main chamber is pumped by a turbomolecular pump backed by a rotary vane mechanical pump. The typical base pressure is 5E-5 Torr. Wafer sizes up to 8 inches are allowed.